Resin composition and article made therefrom

A resin composition and an article made from the resin composition are disclosed. The resin composition comprises: a first vinyl-containing polyphenylene oxide resin, a prepolymer thereof or both; anda second vinyl-containing polyphenylene oxide resin or a prepolymer thereof, wherein the first vinyl...

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Bibliographische Detailangaben
Hauptverfasser:	TAN KOK-SHENG, HSU CHING-HSIEN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Beschreibung
Zusammenfassung:	A resin composition and an article made from the resin composition are disclosed. The resin composition comprises: a first vinyl-containing polyphenylene oxide resin, a prepolymer thereof or both; anda second vinyl-containing polyphenylene oxide resin or a prepolymer thereof, wherein the first vinyl-containing polyphenylene oxide resin has a number average molecular weight of between 500 and 1500, and the second vinyl-containing polyphenylene oxide resin has a number average molecular weight of between 1600 and 3500. 本发明公开一种树脂组合物及由其制成的物品。该树脂组合物包括：第一含乙烯基聚苯醚树脂、其预聚物或二者；以及第二含乙烯基聚苯醚树脂或其预聚物；其中，该第一含乙烯基聚苯醚树脂的数均分子量介于500至1500，且该第二含乙烯基聚苯醚树脂的数均分子量介于1600至3500。