POSITIVE ELECTRODE FOR ELECTROLYTIC COPPER PLATING AND ELECTROLYTIC COPPER PLATING APPARATUS USING SAME

The purpose of the present invention is to provide: a positive electrode for electrolytic copper plating with which plating characteristics such as plating facilitation and via-filling properties canbe improved without increasing the complexity of the apparatus structure; and an electrolytic copper plating apparatus using the same. To achieve said purpose, a positive electrode for electrolytic copper plating that is to be disposed in an electrolysis tank in which an electrolytic copper plating solution is stored, is characterized in that: said electrolytic copper plating solution is an acidicelectrolytic copper plating solution containing a disulfide compound; and said positive electrode is provided such that a soluble copper positive electrode and an insoluble positive electrode are electrically connected. 本发明提供一种装置结构不复杂化也能够提高促电镀性或通孔填充性等电镀特性的电解镀铜用阳极、及使用该阳极的电解镀铜装置。本发明的电解镀铜用阳极为在存储有电解镀铜液的电解处理槽内配置的阳极，其特征在于，该电解镀铜液为含有二硫化合物的酸性电解镀铜液，该阳极具备电性连接状态的可溶性铜阳极和不溶性阳极。