Solder resist ink baking multi-layer shelf

The invention belongs to the technical field of circuit board manufacturing, and particularly relates to a solder resist ink baking multi-layer frame. The solder resist ink baking multi-layer frame comprises a base, a support, discharging frames and a connecting assembly. The support comprises two parallel vertical frames arranged on the base. The multiple layers of discharging frames are sequentially and horizontally arranged on the upper surface of the base in a stacked mode, each layer of discharging frame comprises a grid frame and a supporting piece arranged at one end of the grid frame,and frame strips which are interwoven to form the grid frames are connected in a flush mode to form a plane where a rigid-flex board is placed. The connecting assembly is arranged at the other ends ofthe discharging frames so that the discharging frames can be connected to the vertical frames. Compared with a conventional grid frame formed by weaving frame strips in a staggered mode, the frame strips of the solder resist