Semiconductor package
The invention relates to a semiconductor package. The semiconductor package includes: a connection member having a first surface and a second surface opposing each other, and including a first redistribution layer; a semiconductor chip disposed on the first surface of the connection member and havin...
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| creator | BAE SUNG HAWN KIM JUNG SOO HAN PYUNG HWA |
| description | The invention relates to a semiconductor package. The semiconductor package includes: a connection member having a first surface and a second surface opposing each other, and including a first redistribution layer; a semiconductor chip disposed on the first surface of the connection member and having connection pads connected to the first redistribution layer; an encapsulant disposed on the firstsurface of the connection member and encapsulating the semiconductor chip; a wiring structure connected to the first redistribution layer and extending in a thickness direction of the encapsulant; a second redistribution layer disposed on the encapsulant and connected to the wiring structure; and a mark disposed on the encapsulant and including a plurality of metal patterns providing identification information and a circuit line connected to the second redistribution layer.
本发明涉及一种半导体封装件，所述半导体封装件包括：连接构件，具有彼此背对的第一表面和第二表面，并且包括第一重新分布层；半导体芯片，设置在所述连接构件的所述第一表面上，并且具有连接到所述第一重新分布层的连接焊盘；包封剂，设置在所述连接构件的所述第一表面上，并且包封所述半导体芯片；布线结构，连接 |
| format | Patent |
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本发明涉及一种半导体封装件，所述半导体封装件包括：连接构件，具有彼此背对的第一表面和第二表面，并且包括第一重新分布层；半导体芯片，设置在所述连接构件的所述第一表面上，并且具有连接到所述第一重新分布层的连接焊盘；包封剂，设置在所述连接构件的所述第一表面上，并且包封所述半导体芯片；布线结构，连接</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200410&DB=EPODOC&CC=CN&NR=110993586A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200410&DB=EPODOC&CC=CN&NR=110993586A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BAE SUNG HAWN</creatorcontrib><creatorcontrib>KIM JUNG SOO</creatorcontrib><creatorcontrib>HAN PYUNG HWA</creatorcontrib><title>Semiconductor package</title><description>The invention relates to a semiconductor package. The semiconductor package includes: a connection member having a first surface and a second surface opposing each other, and including a first redistribution layer; a semiconductor chip disposed on the first surface of the connection member and having connection pads connected to the first redistribution layer; an encapsulant disposed on the firstsurface of the connection member and encapsulating the semiconductor chip; a wiring structure connected to the first redistribution layer and extending in a thickness direction of the encapsulant; a second redistribution layer disposed on the encapsulant and connected to the wiring structure; and a mark disposed on the encapsulant and including a plurality of metal patterns providing identification information and a circuit line connected to the second redistribution layer.
本发明涉及一种半导体封装件，所述半导体封装件包括：连接构件，具有彼此背对的第一表面和第二表面，并且包括第一重新分布层；半导体芯片，设置在所述连接构件的所述第一表面上，并且具有连接到所述第一重新分布层的连接焊盘；包封剂，设置在所述连接构件的所述第一表面上，并且包封所述半导体芯片；布线结构，连接</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBANTs3NTM7PSylNLskvUihITM5OTE_lYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxUBVqXmpJfHOfoaGBpaWxqYWZo7GxKgBAIfwIVs</recordid><startdate>20200410</startdate><enddate>20200410</enddate><creator>BAE SUNG HAWN</creator><creator>KIM JUNG SOO</creator><creator>HAN PYUNG HWA</creator><scope>EVB</scope></search><sort><creationdate>20200410</creationdate><title>Semiconductor package</title><author>BAE SUNG HAWN ; KIM JUNG SOO ; HAN PYUNG HWA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN110993586A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>BAE SUNG HAWN</creatorcontrib><creatorcontrib>KIM JUNG SOO</creatorcontrib><creatorcontrib>HAN PYUNG HWA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BAE SUNG HAWN</au><au>KIM JUNG SOO</au><au>HAN PYUNG HWA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Semiconductor package</title><date>2020-04-10</date><risdate>2020</risdate><abstract>The invention relates to a semiconductor package. The semiconductor package includes: a connection member having a first surface and a second surface opposing each other, and including a first redistribution layer; a semiconductor chip disposed on the first surface of the connection member and having connection pads connected to the first redistribution layer; an encapsulant disposed on the firstsurface of the connection member and encapsulating the semiconductor chip; a wiring structure connected to the first redistribution layer and extending in a thickness direction of the encapsulant; a second redistribution layer disposed on the encapsulant and connected to the wiring structure; and a mark disposed on the encapsulant and including a plurality of metal patterns providing identification information and a circuit line connected to the second redistribution layer.
本发明涉及一种半导体封装件，所述半导体封装件包括：连接构件，具有彼此背对的第一表面和第二表面，并且包括第一重新分布层；半导体芯片，设置在所述连接构件的所述第一表面上，并且具有连接到所述第一重新分布层的连接焊盘；包封剂，设置在所述连接构件的所述第一表面上，并且包封所述半导体芯片；布线结构，连接</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Semiconductor package |
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