Semiconductor package

The invention relates to a semiconductor package. The semiconductor package includes: a connection member having a first surface and a second surface opposing each other, and including a first redistribution layer; a semiconductor chip disposed on the first surface of the connection member and having connection pads connected to the first redistribution layer; an encapsulant disposed on the firstsurface of the connection member and encapsulating the semiconductor chip; a wiring structure connected to the first redistribution layer and extending in a thickness direction of the encapsulant; a second redistribution layer disposed on the encapsulant and connected to the wiring structure; and a mark disposed on the encapsulant and including a plurality of metal patterns providing identification information and a circuit line connected to the second redistribution layer. 本发明涉及一种半导体封装件，所述半导体封装件包括：连接构件，具有彼此背对的第一表面和第二表面，并且包括第一重新分布层；半导体芯片，设置在所述连接构件的所述第一表面上，并且具有连接到所述第一重新分布层的连接焊盘；包封剂，设置在所述连接构件的所述第一表面上，并且包封所述半导体芯片；布线结构，连接