Acquisition method of laser resistance trimming scheme, laser resistance trimming scheme and chip resistor

The invention relates to the technical field of laser resistance trimming, in particular to an acquisition method of a laser resistance trimming scheme, the laser resistance trimming scheme and a chipresistor. The acquisition method of the laser resistance trimming scheme comprises the following ste...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHEN DEJIA, PENG RONGSEN, LIU JIAN, HUANG ZHIJIA, KE ZHIQUAN, CHENG XUEPING
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to the technical field of laser resistance trimming, in particular to an acquisition method of a laser resistance trimming scheme, the laser resistance trimming scheme and a chipresistor. The acquisition method of the laser resistance trimming scheme comprises the following steps that a to-be-trimmed resistor is subjected to primary cutting through a serpentine knife edge, so that the resistance value precision of the to-be-trimmed resistor reaches the preset precision, and the value range of the preset precision is 0.1%-1%; the to-be-trimmed resistor is subjected to secondary cutting through the cutter edge; it is judged whether the resistance precision of the to-be-trimmed resistor reaches the target precision or not; and if the resistance precision of the to-be-trimmed resistor reaches the target precision, it is determined that the laser resistance trimming scheme is that the blank resistor is cut by the serpentine knife edge and the bisection knife edge in sequence. The laser resist