High-performance chip heat dissipation device

The embodiment of the invention discloses a high-performance chip heat dissipation device. The high-performance chip heat dissipation device comprises a heat dissipation assembly and a waste heat power generation assembly, and a first microfluid channel is arranged in the heat dissipation assembly; a second microfluid channel is arranged in the waste heat power generation assembly; the first microfluid channel and the second microfluid channel are connected end to end to form a circulating pipeline; a micro hydraulic pump is arranged on the circulating pipeline; the circulating pipeline is filled with cooling liquid; and the waste heat power generation assembly is electrically connected with the storage battery. The invention aims to solve the problem of difficult heat dissipation of a high-performance chip. By combining the efficient heat dissipation performance of the microfluid channel liquid cooling technology and the rapid thermoelectric conversion effect of the thermoelectric material, rapid and efficie