Packaging structure and preparation method thereof

The invention provides a packaging structure and a preparation method thereof. The packaging structure comprises a chip and a packaging layer wrapping the chip, in order to improve the heat dissipation effect of the chip, the packaging structure further comprises a heat dissipation structure, and when the heat dissipation structure is arranged, the heat dissipation structure is embedded in the packaging layer and is in heat conduction connection with the chip. Therefore, heat emitted by the chip is conducted out, and the heat dissipation effect of the chip is improved. 本发明提供了一种封装结构及其制备方法，该封装结构包括一个芯片以及包裹在所述芯片上的封装层，为了提高芯片的散热效果，该封装结构还包括一个散热结构，并且在设置该散热结构时，该散热结构镶嵌在封装层中并与所述芯片导热连。从而将芯片散发出的热量导出来，提高芯片的散热效果。