Heat treatment method and apparatus of substrate
The invention relates to a heat treatment method and apparatus of a substrate. A heat treatment method of a substrate includes setting a temperature profile over the course of stabilization to a target temperature after the substrate is loaded as a reference, and controlling a temperature of the hot...
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| Hauptverfasser: | , , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The invention relates to a heat treatment method and apparatus of a substrate. A heat treatment method of a substrate includes setting a temperature profile over the course of stabilization to a target temperature after the substrate is loaded as a reference, and controlling a temperature of the hot plate supporting the substrate on the basis of the reference.
本发明涉及一种基板的热处理方法及热处理装置，基板的热处理方法包括以下步骤：将装载基板之后向目标温度稳定的过程中的温度状况设定为基准；以及根据设定的所述基准来控制支承基板的所述热板的温度。 |
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