METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD

The present invention discloses a method for manufacturing a multilayer printed wiring board, and the method comprises a step for preparing a first wiring board (L1) in which signal lines (121, 122) are formed on the principal surface of a first insulating substrate (11), and a second wiring board (L2) in which a second electrically conductive layer (15) is formed on the principal surface of a second insulating substrate (14), the second wiring board (L2) being laminated on the first wiring board (L1); a step for placing spacers (21) of a designated thickness at positions set at a designated distance apart from the outer edge of a circuit region (12A) along at least a portion of the outer edge; a step for forming an adhesion layer (20) in the circuit region (12A) with spaces (22) providedbetween the adhesion layer (20) and the spacers (21); and a step for thermocompressively bonding the first wiring board (L1) and the second wiring board (L2) with the adhesion layer (20) interposed therebetween. The designate