Two-component addition type organic silicon heat-conducting adhesive and preparation method thereof
The invention provides a two-component addition type organic silicon heat-conducting adhesive and a preparation method thereof. The two-component addition type organic silicon heat-conducting adhesiveis prepared from a component A and a component B, wherein the component A is prepared from the follo...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a two-component addition type organic silicon heat-conducting adhesive and a preparation method thereof. The two-component addition type organic silicon heat-conducting adhesiveis prepared from a component A and a component B, wherein the component A is prepared from the following components in parts by weight; 15-50 parts of vinyl silicone oil, 0.1-2 parts of an anti-settling agent, 44-78 parts of modified silicon micro powder, 0.5-6 parts of an auxiliary heat-conducting filler, and 0.001-0.1 part of a platinum catalyst, and the component B comprises the following components in parts by weight: 12-35 parts of vinyl silicone oil, 3-15 parts of hydrogen-containing silicone oil, 0.1-2 parts of an anti-settling agent, 44-78 parts of modified silicon micro powder, 0.5-6parts of an auxiliary heat-conducting filler and 0.001-0.1 part of an inhibitor. According to the invention, a structure modification regulator is prepared from an organosilane coupling agent containing non-active organic fun |
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