Multiple zone pad conditioning disk

The invention provides a pad conditioning disk configured to condition a polishing pad of a chemical mechanical polishing tool including a plurality of zones comprising cutting elements that selectively engage the polishing pad based on a positioning of the plurality of zones, is provided. An associated chemical mechanical polishing (CMP) tool and method for conditioning a polishing pad during a chemical mechanical polishing process is also provided. 本发明提供了一种被配置为修整化学机械抛光工具的抛光垫的包括多个区域的垫修整盘，该多个区域包括基于该多个区域的定位而选择性地接合抛光垫的切削元件。本发明还提供了用于在化学机械抛光（CMP）过程中修整抛光垫相关的化学机械抛光工具和方法。