Method for removing FPC cover film

The invention relates to a method for removing an FPC cover film, and the method comprises the steps: removing an outer insulating film of an FPC, and obtaining a first intermediate plate; carrying out bulking on on a first intermediate plate to acquire a second intermediate plate; performing plasma treatment: carrying out plasma treatment on the second intermediate plate to obtain a third intermediate plate; and conducting ultrasonic oscillation cleaning treatment, cleaning the third intermediate plate to acquire a finished product. The method comprises the steps of FPC outer layer insulating film removal, bulking treatment, plasma treatment and oscillation cleaning. Friction treatment are carried out twice so that an insulating film and the flexible glue on the outer layer of FPC can be effectively removed. while a copper wire on an inner layer can be clearly exposed; and the situation that one part of the circuit is ground in place and the other part of a circuit is ground and disappears in the grinding pr