Substitution type electroless gold plating bath containing purine or pyrimidine-based compound having carbonyl oxygen and method using same

The invention provides a substitution type electroless gold plating bath containing purine or pyrimidine-based compound having carbonyl oxygen and a method using the same. According to the present invention, the substitutional electroless gold plating solution comprises: a purine or pyrimidine-based compound having carbonyl oxygen used as a local corrosion blocker capable of preventing local corrosion, which is a critical defect occurring when electroless gold plating is directly performed on the copper wire of a printed circuit board, on a copper surface; a water-soluble gold compound; aminocarboxylic acid as a complexing agent; dicarboxylic acid as a conductivity enhancement agent; alpha-hydroxyl carboxylic acid and heteroaryl carboxylic acid as a base metal elusion inhibition and re-precipitation prevention agent; a sulfite compound as a gold ion stabilizer; an azole compound as a surface correction prevention agent; other surfactants; a crystal control agent; a pH control agent; and a buffering agent. 本发明