Silicon wafer cutting equipment

The invention discloses silicon wafer cutting equipment. The silicon wafer cutting equipment comprises a plane table, an eccentric wheel, an eccentric wheel strut, a workbench, a tool holder, a slider, a first motor, a coupling, an assembly box, a screw rod, a nut fixing seat, a slide rail, a second motor and a tool holder mounting plate, wherein the second motor is arranged on the lower side of the plane table; the second motor is fixed below the plane table through a bolt; the eccentric wheel is arranged on the upper side of the plane table; the eccentric wheel is arranged on an output shaftof the second motor; the eccentric wheel strut is arranged on the right side of the eccentric wheel; the workbench is arranged on the right side of the eccentric wheel strut; a blade is arranged on the upper side of the workbench; the tool holder is arranged at the right side of the blade; the tool holder mounting plate is arranged at the right side of the tool holder; the slider is arranged at the right side of the tool