Corrugated interface bimetal composite plate gluing device

The invention relates to a corrugated interface bimetal composite plate gluing device, which comprises a conveying mechanism, a glue discharging mechanism and a gluing mechanism. The conveying mechanism comprises a transmission assembly; the glue discharging mechanism comprises a glue storage box, a plurality of discharging assemblies arranged at the output end of the glue storage box and arrangedat equal intervals, a control assembly arranged at the output end of the glue storage box in a sliding mode and matched with the discharging assembly to control intermittent discharging of the discharging assembly, a plurality of limiting assemblies located above the discharging assemblies and corresponding to the discharging assemblies, and extrusion assemblies fixedly connected with the controlassembly and arranged at the two sides of the limiting assemblies in a sliding mode; and the gluing mechanism is located between the glue discharging mechanism and the conveying mechanism and comprises a driving assembly and