SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL CONFIGURABILITY

The invention provides a semiconductor device assembly that includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on thedie including at least one active circuit element, and a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements. The substrate includes a substrate contact electrically coupled to both the first and second contact pads. The semiconductor device assembly can further include a second die including a third contact pad electrically coupled to athird circuit on the second die including at least a second active circuit element, and a fourth contact pad electrically coupled to a fourth circuit on the second die including only passive circuit elements. The substrate contact can be electrically coupled to the third contact pad and electrically disconnected from the fourth contact pad. 本发明提供一种半导体装置组合件，其包含衬底及耦合到所述衬底的裸片。所述裸片包含：第一接触垫，其电耦合到所述裸片上的第一电路，所述第一电路包含至少一个有源电路元件；及第