ANTENNA MODULE

An antenna module includes an antenna substrate including a glass substrate having first and second surfaces opposing each other, an antenna pattern disposed on the first surface, and a wiring structure connected to the antenna pattern and extending to the second surface, and a semiconductor package including a semiconductor chip, having an inactive surface and an active surface, on which a connection pad is disposed, an encapsulant encapsulating the semiconductor chip, a connection member including a redistribution layer connected to the connection pad, and a through-via penetrating the encapsulant and connecting the redistribution layer and the wiring structure to each other. 本公开提供一种天线模块，所述天线模块包括：天线基板，所述天线基板包括玻璃基板、天线图案和布线结构，所述玻璃基板具有彼此相对的第一表面和第二表面，所述天线图案设置在所述第一表面上，所述布线结构连接到所述天线图案并且延伸到所述第二表面；以及半导体封装件，包括半导体芯片、包封剂、连接构件和导通孔，所述半导体芯片具有无效表面和设置有连接焊盘的有效表面，所述包封剂包封所述半导体芯片，所述连接构件包括连接到所述连接焊盘的重新分布层，所述导通孔贯穿所述包封剂并且使所述重新分布层与所述布线结构彼此连接。