TERMINAL PLATE AND SEMICONDUCTOR DEVICE

The embodiment of the invention provides a terminal plate with low inductance and a semiconductor device. The terminal plate of the embodiment includes: a first terminal portion, a second terminal portion, a first wiring portion arranged obliquely above the first terminal portion and the second term...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KODANI KAZUYA, HIRAKAWA TATSUYA, MIYAKE EITARO, MATSUYAMA HIROSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The embodiment of the invention provides a terminal plate with low inductance and a semiconductor device. The terminal plate of the embodiment includes: a first terminal portion, a second terminal portion, a first wiring portion arranged obliquely above the first terminal portion and the second terminal portion, a first connection portion provided between the first terminal portion and the first wiring portion and connecting the first terminal portion and the first wiring portion, a second connection portion provided between the second terminal portion and the first wiring portion and connecting the second terminal portion and the first wiring portion, a second wiring portion arranged obliquely above the first terminal portion and the second terminal portion, a third connection portion provided between the first terminal portion and the second wiring portion and connecting the first terminal portion and the second wiring portion, a fourth connection portion provided between the secondterminal portion and the