PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

A package structure and a method of forming the same are provided. The package structure includes a dielectric layer on a die, a RDL structure and a conductive terminal. The RDL structure comprises aredistribution layer in and on the dielectric layer. The redistribution layer comprises a via and a conductive plate. The via is located in and penetrating through the dielectric layer to be connectedto the die. The conductive plate is on the via and the dielectric layer, and is connected to the die through the via. The conductive terminal is electrically connected to the die through the RDL structure. The via is ring-shaped. 提供一种封装结构及其形成方法。封装结构包括位于管芯上的介电层、重布线结构和导电端子。重布线结构包括位于介电层之中和之上的重布线层。重布线层包括通孔和导电板。通孔位于介电层中，并穿过介电层以连接到管芯。导电板位于通孔和介电层上，并通过通孔连接到管芯。导电端子通过重布线结构与管芯电连接。通孔是环形的。