Thin element assembling mechanism and electronic equipment assembling device

The invention provides a thin element assembling mechanism and an electronic equipment assembling device, and the thin element assembling mechanism comprises: a photographing assembly which defines afirst optical axis; a first magnetic component; a second magnetic assembly, wherein the second magnetic assembly and the first magnetic assembly attract each other in a magnetic mode, the second magnetic assembly is movably connected with the first magnetic assembly, and the second magnetic assembly can linearly move by a preset stroke relative to the first magnetic assembly; and a pickup assembly, wherein the pickup assembly is connected with the second magnetic assembly, and the pickup assembly is used for fixing a thin element and positioning the thin element by taking the first optical axis as a reference. According to the thin element assembling mechanism, product deformation or damage caused by excessive force in the thin element mounting process can be avoided. 本发明提出一种薄型元件组装机构和电子设备组装装置，其中所述薄型元件组装机构包括：拍摄组件，所