SEMICONDUCTOR DEVICE PACKAGE

A semiconductor device package includes a carrier and an encapsulant disposed on the carrier. At least one portion of the encapsulant is spaced from the carrier by a space. 一种半导体装置封装包含载体和安置在所述载体上的囊封物。所述囊封物的至少一个部分通过空间与所述载体间隔开。...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	PI TUNING, HUANG YENI, SHIH JIN HAN, HSIEH HAOIH
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A semiconductor device package includes a carrier and an encapsulant disposed on the carrier. At least one portion of the encapsulant is spaced from the carrier by a space. 一种半导体装置封装包含载体和安置在所述载体上的囊封物。所述囊封物的至少一个部分通过空间与所述载体间隔开。