SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING SAME

A semiconductor device package includes a glass carrier, a package body, a first circuit layer and a first antenna layer. The glass carrier has a first surface and a second surface opposite to the first surface. The package body is disposed on the first surface of the glass carrier. The package body has an interconnection structure penetrating the package body. The first circuit layer is disposedon the package body. The first circuit layer has a redistribution layer (RDL) electrically connected to the interconnection structure of the package body. The first antenna layer is disposed on the second surface of the glass carrier. 一种半导体装置封装包含玻璃载体、封装主体、第一电路层和第一天线层。所述玻璃载体具有第一表面和与所述第一表面相对的第二表面。所述封装主体安置于所述玻璃载体的所述第一表面上。所述封装主体具有穿透所述封装主体的互连结构。所述第一电路层安置于所述封装主体上。所述第一电路层具有电连接到所述封装主体的所述互连结构的再分布层RDL。所述第一天线层安置于所述玻璃载体的所述第二表面上。