MULTILAYER CERAMIC CAPACITOR, PACKAGE OF MULTILAYER CERAMIC CAPACITOR AND COMPONENT MOUNTING CIRCUIT SUBSTRATE

The invention relates to a ceramic electronic device, and the device includes a multilayer chip having a first and a second internal electrode layers; a first and a second external electrodes coveringa first a second regions of a surface of the multilayer chip, wherein: a mark is shifted on a side of one of two end faces on an upper face; the first internal electrode layer is exposed to the firstregion and connected to the first external electrode; the second internal electrode layer is exposed to the second region and connected to the second external electrode; the second internal electrodeis shifted further on a side of the lower face than on a side of the upper face; the second internal electrode layer is shifted further on a side of the lower face than the upper face; the second region is a region of a half of the surface on the lower face side. 本发明涉及一种陶瓷电子器件，包括：层叠芯片，具有第一内部电极层和第二内部电极层；第一外部电极和第二外部电极，其覆盖层叠芯片表面的第一区域和第二区域，其中：标记在上表面上偏倚在两个端面之一的一侧；第一内部电极层露出到第一区域并连接至第一外部电极；第二内部电极层露出到第二区域并连接至第二外部电极；相较于上表面侧，第二内部电极更