Ultra-fine diamond wire saw for stone plate-opening forming and manufacturing method of ultra-fine diamond wire saw

The invention provides an ultra-fine diamond wire saw for stone plate-opening forming and a manufacturing method of the ultra-fine diamond wire saw. The ultra-fine diamond wire saw comprises a steel wire with the diameter of 0.6-2 mm. The steel wire is provided with an insulating layer and a non-insulating layer. The length of the non-insulating layer is 1-8 mm, and the length of the insulating layer is 3-30 mm. The insulating layer and the non-insulating layer are arranged alternately. The outer diameter of the insulating layer is less than the outer diameter of the non-insulating layer. Thenon-insulating layer is a diamond layer. The diamond layer and the insulating layer are arranged alternately by an electroplating method. Stone is processed by the ultra-fine diamond wire saw, the cutting gap is small, the outturn percentage of the stone is effectively improved, the loss of the stone is reduced, and the cutting accuracy is improved, so that the surface roughness of the stone aftercutting is low; and meanw