Manufacturing method of micro three-dimensional stacked MEMS (Micro Electro Mechanical System) resonance device

The invention discloses a manufacturing method of a micro three-dimensional stacked MEMS (Micro Electro Mechanical System) resonance device. The micro three-dimensional stacked MEMS resonance device comprises a shell, a cover cap and a chip bracket. A resonance chip is installed on a chip support th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LIN RILE, WANG WEI, LI WENYUN, JIANG ZHAOXING, LUO HUA, ZHAO JIANHUA, WENG BANGYING, XIE JIAWEI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a manufacturing method of a micro three-dimensional stacked MEMS (Micro Electro Mechanical System) resonance device. The micro three-dimensional stacked MEMS resonance device comprises a shell, a cover cap and a chip bracket. A resonance chip is installed on a chip support through a fixing part and a resonance beam is suspended. The chip support is installed on the inner wall of the shell and electrically connected with the shell. An integrated chip installation groove is formed in the inner bottom face of the shell. An integrated chip electrically connected with the shell is installed in the integrated chip installation groove. The manufacturing method of the micro three-dimensional stacked MEMS resonance device comprises the steps of manfuctring the resonance chip; manufacturing a chip support; mounting a resonance chip on the chip bracket; installing an integrated chip in the integrated chip installation groove, and electrically connecting the integrated chipwith the shell; installi