Processing method of solder resist semi-plugged hole

The invention provides a processing method of a solder resist semi-plugged hole, which comprises the following steps: plugged hole printing is carried out, namely, solder resist ink is printed at a through hole of a PCB with the through hole through a copper surface to plug the hole, the solder resi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LIU DONGHU, LENG YAJUAN, GUO MINGLIANG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a processing method of a solder resist semi-plugged hole, which comprises the following steps: plugged hole printing is carried out, namely, solder resist ink is printed at a through hole of a PCB with the through hole through a copper surface to plug the hole, the solder resist ink fills the through hole, and the through hole filled with the solder resist ink is a plugged hole; plugged hole exposing is carried out, namely, single-side exposure is performed on the solder resist ink at the plugged hole; plugged hole developing is carried out, namely, the plugged hole is developed, the windowing surface of the plugged hole is free of development residues, the ink in the plugged hole is as deep as possible, and the plugged hole is changed into a semi-plugged hole; plugged hole curing is carried out, namely, the semi-plugged hole is dried at high temperature for curing; and surface oil processing is carried out, namely, cleaning treatment, printing, drying, exposing,developing and curing ba