Wafer heat dissipation structure, computing power board and computing equipment

The invention provides a wafer heat dissipation structure. The heat radiation structure is characterized by comprising a chip packaging body, a heat radiator and a heat conduction layer, wherein the chip packaging body is provided with a plurality of surfaces, the radiator is attached to at least one surface of a plurality of surfaces of the chip packaging body through the heat conduction layer, and the heat conduction layer is liquid metal. 本公开提供了一种晶片散热结构，其特征在于，包括：晶片封装体、散热器以及导热层；所述晶片封装体具有多个表面，所述散热器通过所述导热层贴附于所述晶片封装体多个表面的至少一个表面上，所述导热层为液体金属。