DIELECTRIC COMPOSITE AND USES THEREOF

The invention provides a dielectric composite including at least one first dielectric layer and at least one second dielectric layer. The dielectric constant temperature coefficient (TCDk) of the first dielectric layer is not more than -150 ppm/DEG C; the dielectric constant temperature coefficient...

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Bibliographische Detailangaben
Hauptverfasser: LIU SHUR-FEN, HUNG CHIN-HSIEN, LIU CHANGIH, YANG WEI-JUNG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a dielectric composite including at least one first dielectric layer and at least one second dielectric layer. The dielectric constant temperature coefficient (TCDk) of the first dielectric layer is not more than -150 ppm/DEG C; the dielectric constant temperature coefficient (TCDk) of the second dielectric layer is not less than 50 ppm/DEG C; the dielectric constant (Dk) ofthe dielectric composite is not less than 4; the dielectric constant temperature coefficient (TCDk) of the dielectric composite is 0 to -150 ppm/DEG C. 本发明提供一种介电复合物,其包括:至少一层第一介电层;以及至少一层第二介电层,其中该第一介电层的介电常数温度系数(TCDk)不大于-150ppm/°C,且该第二介电层的介电常数温度系数(TCDk)不小于50ppm/°C;以及该介电复合物的介电常数(Dk)不小于4,且该介电复合物的介电常数温度系数(TCDk)为0至-150ppm/°C。