SPLITTING APPARATUS AND SPLITTING METHOD

The invention relates to a splitting apparatus and a splitting method; the splitting apparatus includes: a lower mold configured to allow placement of a plate material on the lower mold and arranged on a first side with respect to a split target line of the plate material; an upper blade configured...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HASHIMOTO TAKAHIRO, SAKAKIBARA NOBUYUKI, MIURA MASAYUKI
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The invention relates to a splitting apparatus and a splitting method; the splitting apparatus includes: a lower mold configured to allow placement of a plate material on the lower mold and arranged on a first side with respect to a split target line of the plate material; an upper blade configured to be raised or lowered with respect to the lower mold; and a support member arranged on a second side with respect to the split target line of the plate material. The splitting apparatus is configured that, in a case where the upper blade is lowered with respect to the lower mold in a state where the plate material is supported by the lower mold and the support member, a cut is formed on the split target line of the plate material by the upper blade, a crack is formed in conjunction with formation of the cut, and the plate material is split along the split target line. 本发明涉及截断装置以及截断方法,截断装置具备:下模,构成为能够供板材设置,并相对于板材的截断预定线被配置于第1侧;上刀刃,构成为能够相对于下模升降;和支承部件,该支承部件相对于板材的截断预定线被配置于第2侧。截断装置构成为当在板材被下模以及支承部件支承的状态下使上刀刃相对于下模下降的情况下,通