Substrate processing apparatus and substrate processing method
The present invention provides a technique capable of suppressing a pattern collapse of a concavo-convex pattern when drying a liquid film which covers the concavo-convex pattern. The substrate processing apparatus includes: a substrate holder configured to hold a substrate with a surface of the sub...
Gespeichert in:
| Hauptverfasser: | , , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | IKEDA BOUI IWANAGA KAZUYA HAYASHI MASATO HIDAKA SHOICHIRO SEKIMOTO EIICHI |
| description | The present invention provides a technique capable of suppressing a pattern collapse of a concavo-convex pattern when drying a liquid film which covers the concavo-convex pattern. The substrate processing apparatus includes: a substrate holder configured to hold a substrate with a surface of the substrate on which a concavo-convex pattern is formed oriented upward; a liquid supply unit configuredto supply a processing liquid to the substrate held by the substrate holder to form a liquid film at least in a concave portion of the concavo-convex pattern; a heating unit configured to irradiate the substrate held by the substrate holder or the liquid film with a laser beam for heating the liquid film; and a heating controller configured to control the heating unit, wherein the heating controller controls the heating unit to expose the entire concave portion in a depth direction from the processing liquid by irradiating the laser beam onto the substrate or the liquid film from the heating unit.
本发明提供一种能够抑制覆盖凹凸图案的液膜 |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN110783226A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN110783226A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN110783226A3</originalsourceid><addsrcrecordid>eNrjZLALLk0qLilKLElVKCjKT04tLs7MS1dILChIBIqVFisk5qUoFGNTkptakpGfwsPAmpaYU5zKC6W5GRTdXEOcPXRTC_LjU4sLEpNT81JL4p39DA0NzC2MjYzMHI2JUQMAzMkxeg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Substrate processing apparatus and substrate processing method</title><source>esp@cenet</source><creator>IKEDA BOUI ; IWANAGA KAZUYA ; HAYASHI MASATO ; HIDAKA SHOICHIRO ; SEKIMOTO EIICHI</creator><creatorcontrib>IKEDA BOUI ; IWANAGA KAZUYA ; HAYASHI MASATO ; HIDAKA SHOICHIRO ; SEKIMOTO EIICHI</creatorcontrib><description>The present invention provides a technique capable of suppressing a pattern collapse of a concavo-convex pattern when drying a liquid film which covers the concavo-convex pattern. The substrate processing apparatus includes: a substrate holder configured to hold a substrate with a surface of the substrate on which a concavo-convex pattern is formed oriented upward; a liquid supply unit configuredto supply a processing liquid to the substrate held by the substrate holder to form a liquid film at least in a concave portion of the concavo-convex pattern; a heating unit configured to irradiate the substrate held by the substrate holder or the liquid film with a laser beam for heating the liquid film; and a heating controller configured to control the heating unit, wherein the heating controller controls the heating unit to expose the entire concave portion in a depth direction from the processing liquid by irradiating the laser beam onto the substrate or the liquid film from the heating unit.
本发明提供一种能够抑制覆盖凹凸图案的液膜</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200211&DB=EPODOC&CC=CN&NR=110783226A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200211&DB=EPODOC&CC=CN&NR=110783226A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>IKEDA BOUI</creatorcontrib><creatorcontrib>IWANAGA KAZUYA</creatorcontrib><creatorcontrib>HAYASHI MASATO</creatorcontrib><creatorcontrib>HIDAKA SHOICHIRO</creatorcontrib><creatorcontrib>SEKIMOTO EIICHI</creatorcontrib><title>Substrate processing apparatus and substrate processing method</title><description>The present invention provides a technique capable of suppressing a pattern collapse of a concavo-convex pattern when drying a liquid film which covers the concavo-convex pattern. The substrate processing apparatus includes: a substrate holder configured to hold a substrate with a surface of the substrate on which a concavo-convex pattern is formed oriented upward; a liquid supply unit configuredto supply a processing liquid to the substrate held by the substrate holder to form a liquid film at least in a concave portion of the concavo-convex pattern; a heating unit configured to irradiate the substrate held by the substrate holder or the liquid film with a laser beam for heating the liquid film; and a heating controller configured to control the heating unit, wherein the heating controller controls the heating unit to expose the entire concave portion in a depth direction from the processing liquid by irradiating the laser beam onto the substrate or the liquid film from the heating unit.
本发明提供一种能够抑制覆盖凹凸图案的液膜</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLALLk0qLilKLElVKCjKT04tLs7MS1dILChIBIqVFisk5qUoFGNTkptakpGfwsPAmpaYU5zKC6W5GRTdXEOcPXRTC_LjU4sLEpNT81JL4p39DA0NzC2MjYzMHI2JUQMAzMkxeg</recordid><startdate>20200211</startdate><enddate>20200211</enddate><creator>IKEDA BOUI</creator><creator>IWANAGA KAZUYA</creator><creator>HAYASHI MASATO</creator><creator>HIDAKA SHOICHIRO</creator><creator>SEKIMOTO EIICHI</creator><scope>EVB</scope></search><sort><creationdate>20200211</creationdate><title>Substrate processing apparatus and substrate processing method</title><author>IKEDA BOUI ; IWANAGA KAZUYA ; HAYASHI MASATO ; HIDAKA SHOICHIRO ; SEKIMOTO EIICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN110783226A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>IKEDA BOUI</creatorcontrib><creatorcontrib>IWANAGA KAZUYA</creatorcontrib><creatorcontrib>HAYASHI MASATO</creatorcontrib><creatorcontrib>HIDAKA SHOICHIRO</creatorcontrib><creatorcontrib>SEKIMOTO EIICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>IKEDA BOUI</au><au>IWANAGA KAZUYA</au><au>HAYASHI MASATO</au><au>HIDAKA SHOICHIRO</au><au>SEKIMOTO EIICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Substrate processing apparatus and substrate processing method</title><date>2020-02-11</date><risdate>2020</risdate><abstract>The present invention provides a technique capable of suppressing a pattern collapse of a concavo-convex pattern when drying a liquid film which covers the concavo-convex pattern. The substrate processing apparatus includes: a substrate holder configured to hold a substrate with a surface of the substrate on which a concavo-convex pattern is formed oriented upward; a liquid supply unit configuredto supply a processing liquid to the substrate held by the substrate holder to form a liquid film at least in a concave portion of the concavo-convex pattern; a heating unit configured to irradiate the substrate held by the substrate holder or the liquid film with a laser beam for heating the liquid film; and a heating controller configured to control the heating unit, wherein the heating controller controls the heating unit to expose the entire concave portion in a depth direction from the processing liquid by irradiating the laser beam onto the substrate or the liquid film from the heating unit.
本发明提供一种能够抑制覆盖凹凸图案的液膜</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN110783226A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Substrate processing apparatus and substrate processing method |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-24T09%3A48%3A58IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=IKEDA%20BOUI&rft.date=2020-02-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN110783226A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |