Substrate processing apparatus and substrate processing method

The present invention provides a technique capable of suppressing a pattern collapse of a concavo-convex pattern when drying a liquid film which covers the concavo-convex pattern. The substrate processing apparatus includes: a substrate holder configured to hold a substrate with a surface of the sub...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: IKEDA BOUI, IWANAGA KAZUYA, HAYASHI MASATO, HIDAKA SHOICHIRO, SEKIMOTO EIICHI
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The present invention provides a technique capable of suppressing a pattern collapse of a concavo-convex pattern when drying a liquid film which covers the concavo-convex pattern. The substrate processing apparatus includes: a substrate holder configured to hold a substrate with a surface of the substrate on which a concavo-convex pattern is formed oriented upward; a liquid supply unit configuredto supply a processing liquid to the substrate held by the substrate holder to form a liquid film at least in a concave portion of the concavo-convex pattern; a heating unit configured to irradiate the substrate held by the substrate holder or the liquid film with a laser beam for heating the liquid film; and a heating controller configured to control the heating unit, wherein the heating controller controls the heating unit to expose the entire concave portion in a depth direction from the processing liquid by irradiating the laser beam onto the substrate or the liquid film from the heating unit. 本发明提供一种能够抑制覆盖凹凸图案的液膜