Semiconductor manufacturing method
A semiconductor manufacturing method is provided, and includes forming a material layer over a substrate; illuminating at least one region of the material layer with a light; recording strength of thelight reflected from the at least one region; and determining a thickness of the material layer in t...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | A semiconductor manufacturing method is provided, and includes forming a material layer over a substrate; illuminating at least one region of the material layer with a light; recording strength of thelight reflected from the at least one region; and determining a thickness of the material layer in the at least one region according to the strength of the light.
提供一种半导体制造方法，包括在基板上形成材料层；使用光照射材料层的至少一区域；记录从所述至少一区域反射的光的强度；以及根据所述光的强度，决定材料层在所述至少一区域的厚度。 |
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