Thermosetting resin based on imidazole dinitrile reactive group and preparation method of thermosetting resin
The invention discloses a thermosetting resin based on an imidazole dinitrile reactive group and a preparation method of the thermosetting resin. The thermosetting resin is formed by heating and curing a compound containing imidazole dinitrile, or by heating and curing a blend of a compound containi...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a thermosetting resin based on an imidazole dinitrile reactive group and a preparation method of the thermosetting resin. The thermosetting resin is formed by heating and curing a compound containing imidazole dinitrile, or by heating and curing a blend of a compound containing imidazole dinitrile and a curing agent, wherein the mass ratio of the compound containing imidazole dinitrile to the curing agent is 10:(0.7-1.0). The thermosetting resin is prepared by curing a compound containing imidazole dinitrile or a blend of the compound containing imidazole dinitrile anda curing agent under a nitrogen atmosphere. The thermosetting resin prepared by the invention has excellent thermal stability, thermal oxygen stability and structural modifiability, and is a novel material with wide application value.
本发明公开了一种基于咪唑二腈反应性基团的热固性树脂及其制备方法,所述热固性树脂由含有咪唑二腈的化合物加热固化形成,或者由含有咪唑二腈的化合物和固化剂的共混物加热固化形成,所述含有咪唑二腈的化合物与固化剂的质量比为10:(0.7~1.0)。所述热固性树脂的制备方法是在氮气氛围下,将含有咪唑二腈的化合物,或将含有咪唑二腈的化合物和固化剂的共混物进行固化。本发明所制备的热固性树脂具有 |
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