Multilayer PCB pattern exposure alignment method and device based on eight-point alignment
The invention discloses a multilayer PCB pattern exposure alignment method and device based on eight-point alignment. The method comprises the following steps: first laser drilling target informationand second laser drilling target information are obtained, the overlapping area of a first laser dril...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a multilayer PCB pattern exposure alignment method and device based on eight-point alignment. The method comprises the following steps: first laser drilling target informationand second laser drilling target information are obtained, the overlapping area of a first laser drilling target and a second laser drilling target is calculated, and the center point of the area is determined to serve as a center target; the gravity centers and angle offset of the first laser drilling target and the central target are calculated so as to calculate a first alignment reference forexposure of a first additional layer pattern; and the gravity centers and the angle offset of the second laser drilling target and the central target are calculated so as to calculate a second alignment reference for exposure of a second additional layer pattern. The laser drilling targets and the central target determined according to the overlapping area of the laser drilling targets of the twocore layers are combined fo |
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