SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING APPARATUS

The invention relates to a substrate treating method and a substrate treating apparatus. The substrate treating apparatus includes a process module including a plurality of process units that performa plurality of steps included in a substrate treating process and that perform the substrate treating...

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Bibliographische Detailangaben
Hauptverfasser: SEO TAE WOONG, LEE TAERIM, UM YOUNGJE
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to a substrate treating method and a substrate treating apparatus. The substrate treating apparatus includes a process module including a plurality of process units that performa plurality of steps included in a substrate treating process and that perform the substrate treating process on substrates sequentially placed in the process units based on process recipes for the substrates, a scheduler that controls operations of the process module and the process units included in the process module, a storage that stores transfer paths information of the substrates, and a selection module that selects a process unit to proceed, by a result of feeding back the transfer paths information stored in the storage to the scheduler. The substrate treating apparatus may further include a measuring instrument that measures defect values of the transfer paths information along which the substrates are transferred. The storage may store the defect values measured by the measuringinstrument according to t