Embossing system, glue supply device and embossing method

An embossing system comprises an embossing die and a glue supply device, wherein the embossing die comprises an embossing surface, the glue supply device comprises a glue supply main body and a glue outlet part, the glue supply main body is suitable for driving the glue outlet part to move towards the embossing surface, a first glue layer is provided for the embossing surface by the glue outlet part, and the embossing die is suitable for embossing the first glue layer onto a wafer. Moreover, an embossing method is also provided. 一种压印系统，包括一压印模具及一供胶装置。压印模具具有一压印表面。供胶装置包括一供胶主体及一出胶部。供胶主体适于驱动出胶部往压印表面移动，并藉由出胶部提供一第一胶层至压印表面。压印模具适于将第一胶层压印至一晶圆。此外，一种压印方法亦被提及。