PLATABILITY IMPROVER, MOLDED OBJECT FOR PLATING, PELLET COMPOSITION FOR PLATING, PLATED MOLDED OBJECT, AND PLATING METHOD

The platability improver of the present invention comprises heterophasic-polymer particles having a coefficient of variation in particle diameter of 40-90%. It is preferable that the proportion of polymer particles each having a particle diameter of 0.05 um or larger be 80 vol% or greater with respe...

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Bibliographische Detailangaben
Hauptverfasser:	WATANABE ATSUSHI, TANAKA YUKA, KITAGUCHI HIRONORI, OONO NORIYOSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The platability improver of the present invention comprises heterophasic-polymer particles having a coefficient of variation in particle diameter of 40-90%. It is preferable that the proportion of polymer particles each having a particle diameter of 0.05 um or larger be 80 vol% or greater with respect to all the heterophasic-polymer particles and the proportion of polymer particles each having a particle diameter of 0.05 um or larger but smaller than 0.15 um be 10-60 vol% with respect to all the heterophasic-polymer particles. 本发明的镀敷性改善剂含有粒径的变动系数为40～90％的异相聚合物粒子。优选具有0.05μm以上的粒径的聚合物粒子的含有比例相对于异相聚合物粒子的整体，为80体积％以上，具有0.05μm以上且不到0.15μm的粒径的聚合物粒子的含有比例相对于异相聚合物粒子的整体，为10～60体积％。