Circuit board hole plugging method and circuit board

The invention provides a circuit board hole plugging method and a circuit board. The method comprises the steps of cleaning, hole plugging, foaming and curing. The cleaning step is performed, so thata first circuit board is obtained. According to the hole plugging step, the first circuit board is pr...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NI XINJUN, WU YANJIE, LIU ZHAO
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a circuit board hole plugging method and a circuit board. The method comprises the steps of cleaning, hole plugging, foaming and curing. The cleaning step is performed, so thata first circuit board is obtained. According to the hole plugging step, the first circuit board is printed with foaming hole plugging ink, so that a second circuit board can be obtained, wherein the resin ink can infiltrate the hole walls and middle positions of through holes under the action of surface tension. According to the foaming step, base plates are attached to two sides of the second circuit board, the second circuit board is clamped and fixed to the base plates, and the second circuit board and the base plates are arranged in a drying oven so as to be foamed, and therefore, a thirdcircuit board is obtained. According to the curing step, the third circuit board is arranged in the drying oven of 140-200 DEG C so as to be baked for 10-30 min, so that a finished circuit board is obtained. Vent holes are for