Support table, support table assembly, processing arrangement, and methods thereof
The present invention discloses a support table, a support table assembly, a processing arrangement, and methods thereof. According to various embodiments, a support table (100) may include: a baseplate (102) including a support structure (104), the support structure (104) defining a support region...
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| creator | MARKUS OTTOWITZ DANIEL BRUNNER BERNHARD GOLLER LUKAS FERLAN WALTER LEITGEB |
| description | The present invention discloses a support table, a support table assembly, a processing arrangement, and methods thereof. According to various embodiments, a support table (100) may include: a baseplate (102) including a support structure (104), the support structure (104) defining a support region over the baseplate (102) to support at least one of a workpiece or a workpiece carrier (200) therein; and one or more light-emitting components (106) disposed between the baseplate (102) and the support region (104r). The one or more light-emitting components (106r) are configured to emit light intothe support region (104r).
公开了支承台、支承台组装、处理装置及其方法。根据各种实施例，支承台（100）可以包括：基板（102），其包括支承结构（104），支承结构（104）限定在基板（102）上方的支承区（104r）以在其中支承工件或者工件载体（200）中的至少一个；以及一个或多个发光组件（106），其被部署在基板（102）和支承区（104r）之间，其中一个或多个发光组件（106r）被配置为将光发射到支承区（104r）中。 |
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公开了支承台、支承台组装、处理装置及其方法。根据各种实施例，支承台（100）可以包括：基板（102），其包括支承结构（104），支承结构（104）限定在基板（102）上方的支承区（104r）以在其中支承工件或者工件载体（200）中的至少一个；以及一个或多个发光组件（106），其被部署在基板（102）和支承区（104r）之间，其中一个或多个发光组件（106r）被配置为将光发射到支承区（104r）中。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200131&DB=EPODOC&CC=CN&NR=110739259A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200131&DB=EPODOC&CC=CN&NR=110739259A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MARKUS OTTOWITZ</creatorcontrib><creatorcontrib>DANIEL BRUNNER</creatorcontrib><creatorcontrib>BERNHARD GOLLER</creatorcontrib><creatorcontrib>LUKAS FERLAN</creatorcontrib><creatorcontrib>WALTER LEITGEB</creatorcontrib><title>Support table, support table assembly, processing arrangement, and methods thereof</title><description>The present invention discloses a support table, a support table assembly, a processing arrangement, and methods thereof. According to various embodiments, a support table (100) may include: a baseplate (102) including a support structure (104), the support structure (104) defining a support region over the baseplate (102) to support at least one of a workpiece or a workpiece carrier (200) therein; and one or more light-emitting components (106) disposed between the baseplate (102) and the support region (104r). The one or more light-emitting components (106r) are configured to emit light intothe support region (104r).
公开了支承台、支承台组装、处理装置及其方法。根据各种实施例，支承台（100）可以包括：基板（102），其包括支承结构（104），支承结构（104）限定在基板（102）上方的支承区（104r）以在其中支承工件或者工件载体（200）中的至少一个；以及一个或多个发光组件（106），其被部署在基板（102）和支承区（104r）之间，其中一个或多个发光组件（106r）被配置为将光发射到支承区（104r）中。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrsKwkAQRuFtLER9h7FfwRhEUkpQrCzUPkySP4mwN3bGwre3sbC0Onxw5uZ2f6UUs5Jy62BJfkksAt-6t6WUYweRZxiJc-YwwiOoJQ49eegUeyGdkBGHpZkN7ASrbxdmfT496ssGKTaQxB0CtKmvRbE9lNVuXx3Lf54POsg4Vg</recordid><startdate>20200131</startdate><enddate>20200131</enddate><creator>MARKUS OTTOWITZ</creator><creator>DANIEL BRUNNER</creator><creator>BERNHARD GOLLER</creator><creator>LUKAS FERLAN</creator><creator>WALTER LEITGEB</creator><scope>EVB</scope></search><sort><creationdate>20200131</creationdate><title>Support table, support table assembly, processing arrangement, and methods thereof</title><author>MARKUS OTTOWITZ ; DANIEL BRUNNER ; BERNHARD GOLLER ; LUKAS FERLAN ; WALTER LEITGEB</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN110739259A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>MARKUS OTTOWITZ</creatorcontrib><creatorcontrib>DANIEL BRUNNER</creatorcontrib><creatorcontrib>BERNHARD GOLLER</creatorcontrib><creatorcontrib>LUKAS FERLAN</creatorcontrib><creatorcontrib>WALTER LEITGEB</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MARKUS OTTOWITZ</au><au>DANIEL BRUNNER</au><au>BERNHARD GOLLER</au><au>LUKAS FERLAN</au><au>WALTER LEITGEB</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Support table, support table assembly, processing arrangement, and methods thereof</title><date>2020-01-31</date><risdate>2020</risdate><abstract>The present invention discloses a support table, a support table assembly, a processing arrangement, and methods thereof. According to various embodiments, a support table (100) may include: a baseplate (102) including a support structure (104), the support structure (104) defining a support region over the baseplate (102) to support at least one of a workpiece or a workpiece carrier (200) therein; and one or more light-emitting components (106) disposed between the baseplate (102) and the support region (104r). The one or more light-emitting components (106r) are configured to emit light intothe support region (104r).
公开了支承台、支承台组装、处理装置及其方法。根据各种实施例，支承台（100）可以包括：基板（102），其包括支承结构（104），支承结构（104）限定在基板（102）上方的支承区（104r）以在其中支承工件或者工件载体（200）中的至少一个；以及一个或多个发光组件（106），其被部署在基板（102）和支承区（104r）之间，其中一个或多个发光组件（106r）被配置为将光发射到支承区（104r）中。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Support table, support table assembly, processing arrangement, and methods thereof |
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