Open electrocardiogram sensor packaging technology

The invention discloses an open electrocardiogram sensor packaging technology. The open electrocardiogram sensor packaging technology comprises a film pasting and cutting process, a frame pasting process, a photosensitive chip pasting process, a first curing process, a light-emitting chip pasting process, a second curing process and a bonding wire process. According to the film pasting and cuttingprocess, a substrate is pasted on a circular ring to which a UV film is attached; the substrate is cut into a base with a specified size along a preset cutting channel; the base is transferred to a film pasting carrier. According to the photosensitive chip pasting process, a plurality of photosensitive chips are pasted on the base. According to the first curing process, curing treatment is performed on the base which has been subjected to the photosensitive chip pasting process. According to the light-emitting chip pasting process, light-emitting chips are pasted on the base which has been subjected to the first curi