Semiconductor device

A semiconductor device according to an embodiment comprises a substrate and a first semiconductor chip provided above the substrate. A second semiconductor chip is provided above the first semiconductor chip. A spacer chip is provided between the first semiconductor chip and the second semiconductor...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WATANABE TAKESHI, AMANO AYANA, UCHIDA YUKI, SUGO YUKI, IKEBE REISHUKU, HAYAKAWA KEN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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