Semiconductor device

A semiconductor device according to an embodiment comprises a substrate and a first semiconductor chip provided above the substrate. A second semiconductor chip is provided above the first semiconductor chip. A spacer chip is provided between the first semiconductor chip and the second semiconductor chip with regard to a direction orthogonal to a mount surface of the substrate, the spacer chip being made of a first resin material. A first adhesive material is provided between the spacer chip and the substrate or the first semiconductor chip. A second adhesive material is provided between the spacer chip and the second semiconductor chip. A second resin material covers the first and second semiconductor chips and the spacer chip. 根据实施例的半导体装置包括衬底和提供在所述衬底上方的第一半导体芯片。第二半导体芯片提供在所述第一半导体芯片上方。相对于与所述衬底的安装表面正交的方向，间隔物芯片提供在所述第一半导体芯片与所述第二半导体芯片之间，所述间隔物芯片由第一树脂材料制成。第一粘合剂材料提供在所述间隔物芯片与所述衬底或所述第一半导体芯片之间。第二粘合剂材料提供在所述间隔物芯片与所述第二半导体芯片之间。第二树脂材料覆盖所述第一和第二半导体芯片以及所述间隔物芯片。