Electronic equipment reliability evaluation method based on multi-stress coupling

The invention discloses an electronic equipment reliability evaluation method based on multi-stress coupling. The method comprises the following steps: S1, determining a failure mode and a failure mechanism of electronic equipment under electric-thermal-force field coupling; s2, establishing an elec...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	QIN PAN, SU YAHUI, WAN GUOSHI, ZHAO LEI, WANG ZHIWEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING PHYSICS
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