Electronic equipment reliability evaluation method based on multi-stress coupling

The invention discloses an electronic equipment reliability evaluation method based on multi-stress coupling. The method comprises the following steps: S1, determining a failure mode and a failure mechanism of electronic equipment under electric-thermal-force field coupling; s2, establishing an electronic equipment reliability physical model under multi-stress coupling according to the electronicequipment failure mode and failure mechanism determined in the step S1; s3, performing reliability simulation analysis on the electronic equipment according to the reliability physical model; and s4,evaluating the reliability index of the electronic equipment according to the reliability weak link determined in the step S3. The method does not depend on reliable service life data, but analyzes process parameter information, structural material information and working and using environment stress conditions of the electronic equipment, so that the difficulty of insufficient service life data can be effectively avoided,