Component mounting apparatus

The invention relates to a component mounting apparatus which picks up a component supplied from a component feeder by a mounting head and mounts it on a substrate. The component mounting apparatus comprises a cover which is above the component feeder and covers a first position outside the movable...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SAKAMOTO HIROSHI, KISHITA KOJI, OTA HIROSHI, NOTOMI RYO, YAMADA YOSHINORI, NISHIJIMA RYOTA, NAGAHARA MASAO, KONDA YOSHINORI, YOSHIMOTO KOJI, OBARA HIROFUMI, KUDO HIDEO
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to a component mounting apparatus which picks up a component supplied from a component feeder by a mounting head and mounts it on a substrate. The component mounting apparatus comprises a cover which is above the component feeder and covers a first position outside the movable limit position of the mounting head; and a slide mechanism which slidably holds the cover between the first position and a second position inside the movable limit position. 本发明涉及一种部件搭载装置,其利用搭载头拾取从部件供给装置供给的部件并将该部件搭载到基板。部件搭载装置具有罩和滑动机构。罩设置于部件供给装置的上方,并覆盖比搭载头的可动极限位置靠外侧的第一位置。滑动机构在所述第一位置与比所述可动极限位置靠内侧的第二位置之间将所述罩保持为能够滑动。