Preparation method of high-temperature alloy semi-closed adapter pipe of dual-layer thin-walled structure
The invention provides a preparation method of a high-temperature alloy semi-closed adapter pipe of a dual-layer thin-walled structure. The preparation method comprises the steps of design of a forming mold, design of a blank, forming of an outer pipe, filling of a core mold, assembly of an inner pi...
Gespeichert in:
Hauptverfasser: | , , , , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention provides a preparation method of a high-temperature alloy semi-closed adapter pipe of a dual-layer thin-walled structure. The preparation method comprises the steps of design of a forming mold, design of a blank, forming of an outer pipe, filling of a core mold, assembly of an inner pipe, forming of the inner pipe, cutting away of the process end, heating core mold removal and the like. According to the preparation method, hydraulic forming is adopted, the forming manner is simple, the requirement for mold materials is low, the forming efficiency and forming precision are high, and cost is low; and a low-melting-point alloy is adopted as a semi-closed core mold free of a mold drawing clearance, semi-closed clearance forming is achieved, the core mold is easy to process and convenient to remove, and no residue is generated. The high-temperature alloy adapter pipe prepared through the method adopts the dual-layer structure, is high in rigidity and light and can serve as a high and low temperature |
---|