SEMICONDUCTOR DEVICE

Semiconductor chips (2, 3) are mounted on a heat sink (1). Multiple lead terminals (5, 6) are connected to the semiconductor chips (2, 3). The multiple lead terminals (5, 6) include a first lead terminal through which a high-frequency signal is passed. Multiple dielectric bodies (10, 11) that are se...

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Bibliographische Detailangaben
Hauptverfasser:	CHOMEI KENICHIRO, MIYAWAKI KATSUMI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Semiconductor chips (2, 3) are mounted on a heat sink (1). Multiple lead terminals (5, 6) are connected to the semiconductor chips (2, 3). The multiple lead terminals (5, 6) include a first lead terminal through which a high-frequency signal is passed. Multiple dielectric bodies (10, 11) that are separated from each other are individually disposed between the multiple lead terminals (5, 6) and theheat sink (1). A sealing resin (12) seals the semiconductor chips (2, 3), the multiple lead terminals (5, 6), and the multiple dielectric bodies (10, 11). 在散热器(1)之上安装有半导体芯片(2、3)。多个引线端子(5、6)与半导体芯片(2、3)连接。多个引线端子(5、6)具有使高频信号通过的第1引线端子。彼此分离的多个电介质(10、11)分别单独地设置在多个引线端子(5、6)与散热器(1)之间。封装树脂(12)将半导体芯片(2、3)、多个引线端子(5、6)以及多个电介质(10、11)进行封装。