Semiconductor device including through via in mold pillar

A semiconductor device is disclosed that includes a stack of semiconductor bare elements. As the semiconductor bare elements are added to the stack, openings are formed in the semiconductor bare elements, wherein the openings are aligned at different stages of the stack. The openings are filled with an electrically insulating compound to form molded pillars through all of the semiconductor bare elements in the stack. After adding all the semiconductor bare elements to the stack, through holes may be drilled through the molding posts to electrically interconnect each of the semiconductor bare elements in the stack. 公开了一种半导体装置，其包含半导体裸芯的堆叠体。随着半导体裸芯被添加到堆叠体，在半导体裸芯中形成开口，其中开口在堆叠体的不同级对准。开口填充有电绝缘化合物，以穿过堆叠体中的全部半导体裸芯形成模塑柱。在将全部半导体裸芯添加到堆叠体之后，可以穿过模塑柱钻取通孔，以将堆叠体中的每个半导体裸芯电互连。