Substrate, chip, circuit board and supercomputing equipment

The invention provides a substrate, a chip, a circuit board and supercomputing equipment. The substrate comprises a substrate body, and a first pad and a second pad are arranged on the first surface of the substrate body; the first surface is provided with a mapping area, and the mapping area is an area mapped by a bare wafer on the first surface; and a supporting part is arranged on the mapping area and is used for supporting the first surface. In the packaging process, the stress of the substrate is uniform, and the stress of a portion, provided with the first pad, of the substrate and the stress of a portion, provided with the second pad, of the substrate are uniform, so the two portions cannot deform, therefore the substrate is prevented from being damaged and deformed; and the base plate does not deform, so the bare wafer can be in good contact with the second surface of the base plate, the stress of the bare wafer is uniform, the bare wafer cannot be broken, collision and impactbetween the bare wafer an